Dr. Milena Vujosevic is a senior manager and technologist with more than 20 years of experience in semiconductors industry in technology development, design and reliability. She is a Senior Director for Advanced Packaging at TDK-InvenSense where she leads a global packaging organization and oversees MEMS sensors packaging from technology development to NPI and HVM. Prior to joining TDK-InvenSense in 2018, Milena was a Principal Engineer (Technical Director) at Intel where she worked on package technology development, design and reliability for most advanced technology nodes. Earlier in her career, she worked for Motorola on MEMS sensors for automotive, medical and consumer electronics markets.
Milena has published more then 60 papers, 3 book chapters, has been active participant in industry packaging consortia and in the forums developing new industry standards. She is a recipient of 2011 American Society of Mechanical Engineers Women Engineer of the year award for significant achievements in the field of electronic and photonic packaging. Milena has a PhD in Mechanical Engineering.