Dr Mary Ann Maher, CEO & Founder – SoftMems | Topic: Co-design of MEMS, IC, Packaging and Beyond
As MEMS technology has matured, many of the challenges now seen in bringing MEMS based products to market are occurring as multiple MEMS and companion Integrated circuits are combined into systems often on flexible substrates. This talk will cover the challenges and opportunities for designing innovative MEMS systems particularly focusing on the Integrated circuit/MEMS/Package/Substrate co-design and optimization issues. It will further discuss the design flow and ecosystem players for utilizing MEMS in IoT based applications. Examples of design issues and their solutions utilizing computer aided design tools (CAD) specifically targeted at the co-design of MEMS based systems are given. Finally, a perspective on the future design, standards, and ecosystem needs in the MEMS industry as new types of sensors and actuators in the bio/chemical and flexible/stretchable/printed technologies are rolled out is also presented.