Mrs Julie Orlando, Chief Product Officer – Nanotronics Imaging | Topic: From Substrate to Packaging: Using New Methods to Improve MEMS Inspection at Every Step
MEMs manufacturers are deeply aware of the challenges faced by traditional inspection. Historically, operators have had to reference manufacturing art and make detailed comparisons and approximations, often by hand. But what if we were no longer limited by obsolete technology? Imagine addressing the most arcane process-control issues for back-end devices with the help of a single platform. Smaller costs, smaller footprint, simpler. Engineering teams can focus on being creative rather than laboring over microscopes.
By training AI to analyze defects through sparse data, inspection processes are being reinvented. Nanotronics’ nSpec® converges machine learning, automation, and sophisticated imaging techniques to best serve suppliers and their customers. nSpec® solves the unique inspection challenges presented by flexible substrate and singulated devices on film tape or within packing trays. As MEMs-based devices evolve and increase in complexity, Nanotronics continually innovates to meet new inspection challenges.