Dr Thorsten Matthias, Regional Sales Director Asia/Pacific – EVG | Topic: Heterogeneous Integration for Smart Sensors
Autonomous Driving brings significant higher demands on quality, reliability, and precision for the MEMS devices and for the integration of multiple sensors. For many new applications, it is required to combine and process the data from multiple sensors in real time. The recent developments in image sensor manufacturing provide a technological toolbox for future MEMS devices addressing high bandwidth between sensor arrays, memory and application processor, low power consumption due to bumpless electrical interconnects and small form factor due to 3D stacking. Due to the high amount of data generated from optical sensors, close coupling of the optical sensors to the microprocessors will be needed for fast data analysis. Integration of these micro-optical components requires wafer-level optics manufacturing. Hybrid wafer bonding is the key technology for 3D stacking. A new integration scheme for collective die-to-wafer bonding enables heterogeneous integration of III-V or II-VI compound semiconductors into a silicon CMOS fab.