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Dr Milena Vujosevic, Senior Director, Advanced MEMS Packaging – TDK InvenSense | Topic: Challenges in MEMS packaging

18 Mar 2019
17:00 – 17:15

Dr Milena Vujosevic, Senior Director, Advanced MEMS Packaging – TDK InvenSense | Topic: Challenges in MEMS packaging

The talk will discuss MEMS packaging challenges and opportunities in meeting performance, cost, assembly and reliability needs of MEMS sensor technologies . The focus will be on issues of MEMS-package interaction, MEMS-assembly interaction and MEMS system integration as key technical drivers for optimized design and process solutions. Market trends and technology drivers will be used to discuss MEMS packaging technology roadmap.