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Mr Jerry Liu, SMIC

EVP & Head of Technology & Business Devt Center

Mr Jerry Liu, SMIC

EVP & Head of Technology & Business Devt Center

Biography

Previously served as the 3D device and sensor director of SMIC’s R&D center, responsible for the development and industrialization of image sensors, MEMS sensors, and 3D stacked devices; Planning and establishment of SMIC’s specialized production plants for MEMS, CIS, TSV-3D devices and wafer level packaging; responsible for multiple government-supported R&D programs (02 major projects, 973, 863…); planning and establishment of SMIC High-end CIS-BSI back-illuminated image sensor technology roadmap, main product line, successful mass production of China’s first 8-megapixel image sensor chip and high-end full HD surveillance image sensor chip; successful implementation of China’s first 8-inch Micro-electromechanical microphones and inertial sensors were produced in large-scale.
He has been responsible for or has participated in the development of technologies such as DRAM memory, high voltage CMOS and power devices, and logic devices.
15 years of experience in the development of integrated circuit and micro-fabrication process technology, with over 40 granted patents.