Manfred Engelhardt holds a PhD in Solid State Physics from 1984 from the University of Regensburg, Germany. He is a 33-year semiconductor industry veteran. In processing of electronic materials he held several positions at Siemens Semiconductors, Infineon Corporate Research, Infineon Memory Products, and Qimonda on the various frontend sites. In his current position with Infineon Austria he is owner of both the equipment and process roadmaps for plasma etch processes for Infineon worldwide. He has pioneered plasma etching of high-aspect-ratio structures and plasma damage assessment methodologies. He has authored and co-authored more than 150 peer-reviewed papers and about 100 invention disclosures with more than 50 patents and delivered about 100 presentations on international conferences. Manfred is member-at-large and Fellow of the Electrochemical Society Inc. (ECS) and co-organizer of the bi-annual Plasma Processing Symposium of the Society.