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Jean-René Lèquepeys

Head of Silicon Components Division, CEA-Leti

Jean-René Lèquepeys

Head of Silicon Components Division, CEA-Leti

Biography

Jean-René Lèquepeys is the Head of the Silicon Components Division at CEA-Leti since 2011. This division is involved in 3 main areas: micro and nanoelectronics, micro and nanosystems, and 3D stacking. Jean-René Lèquepeys graduated in Electrical Engineering from Supelec in 1983. He was Programs manager of Telecom and Smart devices at CEA-Leti from 1998 to 2004. From 2005 to 2010, he was the Head of the Chip Architecture an IC Design Division at CEA-Leti. In 2000, Jean-René was the winner of the “Grand Prix de l’Electronique Général Férrié” prize for his work in the field of spread spectrum and CDMA radio-communications.

About CEA-LETI

Leti is an institute of CEA, a French research-and-technology organization with activities in energy, IT, healthcare, defence and security. Leti is focused on creating value and innovation through technology transfer to its industrial partners. It specializes in nanotechnologies and their applications, from wireless devices and systems, to biology, healthcare and photonics. NEMS and MEMS are at the core of its activities. CEA-Leti operates 8,000-m² of state-of-the-art clean room space on 200mm and 300mm wafer platforms. It employs 1,700 scientists and engineers including 320 Ph.D. students and 200 assignees from partner companies. CEA-Leti owns more than 2,200 patent families.