Doug Sparks is the Chief Technology Officer at Hanking Electronics where they are working on a new MEMS wafer fab and packaging facility in Shenyang, China. Prior to joining Hanking he was the founder and President of Nanogetters which offers vacuum packaging services for MEMS devices. He was also the Executive Vice President at Integrated Sensing Systems Inc for 10 years where he directed the development and commercialization of MEMS/microfluidic products. He worked at Delphi Automotive System’s Delco Electronics Division for 17 years in the area of MEMS and integrated circuits both in process and packaging. He has published over 100 technical papers, has 47 US and Japanese patents and has a PhD in Material Science from Purdue University.